Company Description

OpenLight is a photonics design company that offers the world’s first open silicon photonics platform with integrated lasers. Our technology is used in Datacom, telecom, LiDAR, healthcare, HPC, AI, and optical computing applications. We have over 300 patents and our technology has been adopted by companies across multiple industries enabling new possibilities for photonics engineering.

Why Join Us

Be part of a cutting-edge startup with a strong history of technology innovation. Work alongside a team of talented professionals in the field of silicon photonics. Competitive salary and benefits package and opportunity for career growth and professional development. If you are highly motivated and technically proficient, apply today to help shape the future of optical applications.

Responsibilities

The candidate will be responsible for the design, implementation, and delivery of photonics integrated circuits (PICs) with optical gain and lasers in the OpenLight proprietary heterogenous silicon-IIIV photonic platform, for applications including data center communications, LiDAR, optical computing, and sensing. The candidate will work cross-functionally with and ensure alignment between customers, business development, component design, layout, test, and reliability engineers in order to deliver PICs that meet expected performance and applications. The candidate will play a critical role in bringing new products to market.

Responsibilities:

• Drive the definition, design, simulation, layout, and test of silicon photonic circuits working with customers and across functional teams within OpenLight.
• Work with customers to map their product requirements onto OpenLight proprietary heterogenous silicon-IIIV photonic platform. Perform initial feasibility studies, define program timelines and deliverables.
• Use industry standards and trends to derive requirements for OpenLight reference PIC designs.
• Use commercial and custom-built tools to design and model custom PICs. Present results to customers and internal stakeholders.
• Coordinate packaging, chip interface requirements, and fabrication requirements with packaging, layout, and process teams.
• Define test requirements, review test plans, and analyze test data.
• Identify, specify, and prioritize new components to develop for the PDK roadmap. Work with component designers to ensure that new components can meet specifications.

Skills and Experience:

• Ph.D. in Electrical Engineering, Applied Material Science, Applied Physics or related discipline
• 10+ years of relevant work experience (professional and PhD experience combined)
• Proven record of working across organization boundaries and driving complex programs to successful completion through collaboration.
• In-depth understanding of photonic integrated circuits and their components: lasers, modulators, amplifiers, detectors, passives, and optical coupling.
• In-depth knowledge of opto-electronic device requirements for datacom and LiDAR applications.
• Hands-on experience with high-speed optical testing is desirable.
• Hands-on experience with packaging is desirable.
• Strong problem-solving, communication, organizational, interpersonal and presentation skills.